chigadzirwa zvinhu
TYPE
TSANANGURA
category
Integrated Circuit (IC)
Yakamisikidzwa - Sisitimu pane Chip (SoC)
mugadziri
AMD Xilinx
series
Zynq®-7000
Package
tray
Product Status
mudura
Architecture
MCU, FPGA
core processor
Imwe ARM® Cortex®-A9 MPCore™ ine CoreSight™
Flash size
-
RAM saizi
256KB
Peripherals
DMA
Kubatana
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
speed
667MHz
main hunhu
Artix™-7 FPGA, 23K logic masero
Kushanda tembiricha
0°C ~ 85°C (TJ)
Package/Enclosure
225-LFBGA, CSPBGA
Supplier Device Packaging
225-CSPBGA (13×13)
I/O kuverenga
54
Basic chigadzirwa nhamba
XC7Z007
Media uye Downloads
RESOURCE TYPE
LINK
Zvinotsanangurwa
Zynq-7000 All Programmable SoC Overview
Zynq-7000 SoC Tsanangudzo
Zynq-7000 User Guide
Ruzivo rwezvakatipoteredza
Xilinx REACH211 Cert
Xiliinx RoHS Chitupa
Featured Products
TE0723 ArduZynq Series ine Xilinx Zynq®-Z-7010/Z-7007S SoCs
Zvese Programmable Zynq®-7000 SoC
EDA/CAD modhi
XC7Z007S-1CLG225C ne SnapEDA
Environment uye Export Classification
ATTRIBUTES
TSANANGURA
RoHS chimiro
Inoenderana neROHS3 yakatarwa
Moisture Sensitivity Level (MSL)
3 (168 maawa)
SVITSA chimiro
Zvigadzirwa zvisiri-REACH
ECCN
3A991D
HTSUS
8542.39.0001
