Parameter
parameter name | hunhu kukosha |
Rohs yakasimbiswa here? | anosangana ne |
Mazita Okutengesa | XILINX (Xilinx) |
Svika Kodhi Yekutevedzera | compli |
ECCN kodhi | 3A991.D |
Kuwanda kwewachi frequency | 667 MHz |
JESD-30 kodhi | S-PBGA-B484 |
JESD-609 kodhi | e1 |
Humidity Sensitivity Level | 3 |
nhamba yezvinyorwa | 338 |
Nhamba yezvikamu zvine musoro | 147443 |
Nguva dzekubuda | 338 |
Nhamba yezviteshi | 484 |
Package body material | PLASTIC/EPOXY |
package code | FBGA |
Encapsulate kodhi yakaenzana | BGA484,22X22,32 |
Pakeji chimiro | SQUARE |
Pakeji fomu | GRID ARRAY, YAKANAKA PITCH |
Peak Reflow Temperature (Celsius) | 260 |
magetsi | 1.2,1.2/3.3,2.5/3.3 V |
Programmable Logic Type | MUNDA PROGRAMMABLE GATE ARRAY |
Chitupa chimiro | Not Qualified |
pamusoro pegomo | EHE |
teknolojia | CMOS |
Terminal surface | TIN SILVER COPPER |
Terminal fomu | Bhora |
Terminal pitch | 0.8 mm |
Terminal nzvimbo | BOTTOM |
Maximum time at peak reflow tembiricha | 30 |